| Corporate Overview |
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| Founded |
| ‧June 22nd,1999 |
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| Capitalization |
| ‧US $ 43M |
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| Location |
| ‧Science-Based Industrial Park,Hsinchu,Taiwan |
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| Employee |
| ‧450 |
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| Production space |
| ‧3,400m2 clean room |
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| Experienced management team in place |
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| Technology |
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In house developed gold bumping, COG and Post-Passivation™ Technology |
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Transferred solder bumping technology from Shinko Electric Inc., Japan |
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Current Business |
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Production around 55K wafers /month; 95% gold bumping, 5% solder bumping and RDL |
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COG production around 4.8KK dice / month |
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