Dr. M. S. Lin, Chairman of Board
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President, Wyse |
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Director of Fab IIB & R&D, TSMC |
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Years of flip chip R&D work at Bell Lab |
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IC Technology R&D at IBM |
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PhD from Harvard University |
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Published over 80 technical papers and granted over 10 US Patents |
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Ling Chen, President
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President, Holtek Semiconductor |
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Sr. V.P. R&D, TI-Acer |
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R&D Director, Macronix |
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Sr. Manager, R&D, TSMC |
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Director, Technology, SEEQ |
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C.K. Chou
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Title：Sr. Director, IP |
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Year：15 |
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Degree：MS |
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Background：Physics |
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Experience：Process Engineering, TSMC |
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Rick Lee
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Title：Sr. FAB Director |
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Year：14 |
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Degree：BS |
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Background：Industrial Eng. |
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Experience：Process Engineering and MFG, TI-Acer |
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K.H. Wan
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Title：Deputy FAB Director |
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Year：11 |
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Degree：PHD |
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Background：Chemistry |
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Experience：Bumping Process Engineering, ChipBond |
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Sammy Wang
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Title：Sr. Director, Sales of North America |
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Year：18 |
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Degree：MS |
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Background：Electrical Eng. |
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Experience：Marketing & Sales, TSMC and UMC |
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Eric Lin
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Title：Director, R&D/COG Fab |
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Year：9 |
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Degree：PHD |
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Background：Chemical Eng. |
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Experience：Flip Chip, CSP, ITRI/ERSO |
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