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| | Production Capability | Process Flow | |
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| Gold Bumping Production Capability |
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| Wafer dimension |
| Diameter：6 & 8 inch |
| Thickness：19~29 mil |
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Bump Shape |
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90°± 3° |
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| Bump height uniformity |
| Target<=17um |
| Within lot ± 3 um |
| Within wafer <4um |
| Within die<2um |
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| Bump Roughness |
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| < 1 um if passivation <1.5 um |
| < 2 um if passivation >1.5 um |
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Bump size |
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± 2.5 um |
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Bump space > 7um |
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| Bump Hardness： |
| Soft Bump：35~80 Hv |
| Hard Bump：75~120 Hv |
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Bump Shear force |
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≧ 5 g/mil2 |
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| Gold Bump Process Flow |
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