| TURNKEY SERVICE FLOW |
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Gold Bumping Service
‧6" and 8" wafer gold bumping with or without polyimide coating |
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Solder Bumping Service
‧8" wafer eutectic with ultra low alpha solder bumping
‧8" wafer lead-free solder (97.5%Sn / 2.5%Ag) bumping |
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Post-Passivation Technology™ (PPT) Service
‧Freeway® ，power / ground and RDL
‧Integrated passive：inductor
‧WLCSP (Q4，05')：prototyping |
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Backend Service
‧COG turnkey service for gold bumping
‧CP service with partner
‧Wafer singulation service for solder bumping |
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MEGIC Online WIP Report
‧ http://mor.megic.com.tw/ |
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